MATERIALS CHARACTERIZATION

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材料特性描述以原始文章为特色，并对材料结构和性能的理论和实践方面进行了最新评论。该杂志关注所有的表征技术，包括所有形式的显微镜（光、电子、声学等）和分析（特别是微观分析和表面分析技术）。这一广泛技术的发展及其在材料微观结构定量化中的应用是本杂志的重要方面。该杂志为材料科学家/工程师提供了许多类型材料的最新信息，其基本主题是用新颖的方法解释材料的行为。期刊所涵盖的材料包括：金属及合金陶瓷纳米材料生物医用材料光学材料复合材料天然材料有机材料请注意，并非所有主题都属于材料表征的范围。以下所列主题的提交将不被考虑出版，括号中指出了潜在的替代期刊：i）薄膜半导体（固体薄膜；半导体加工材料科学）ii）聚合物或聚合物复合材料（Elsevier聚合物标题；复合材料结构）iii）机械、电气或其他性能测量，无任何附带的微观结构特征（根据重点，请考虑提交腐蚀科学；磨损；材料科学与工程B；材料与设计）iv）没有附带微观结构表征组件的计算、理论或分析论文（计算材料科学；材料科学与工程A；材料科学与工程B；材料科学与工程C）

Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials.The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal.The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include:Metals & AlloysCeramicsNanomaterialsBiomedical materialsOptical materialsCompositesNatural MaterialsOrganic materialsPlease note that not all topics fall within the scope of Materials Characterization. Submissions focused on the topics listed below will not be considered for publication, potential alternative journals are indicated in brackets:i) thin film semiconductors (Thin Solid Films; Materials Science in Semiconductor Processing)ii) polymers or polymer composites (Elsevier polymer titles; Composites structures)iii) mechanical, electrical or other property measurements without any accompanying microstructural characterization (depending on the focus, please consider submitting to Corrosion Science; Wear; Materials Science & Engineering B; Materials & Design)iv) computation, theory or analysis papers without an accompanying microstructural characterization component (Computational Materials Science; Materials Science & Engineering A; Materials Science & Engineering B; Materials Science & Engineering C)