IEEE Journal of the Electron Devices Society

IEEE Journal of the Electron Devices Society期刊基本信息

  • 简称:IEEE J ELECTRON DEVI
  • 大类:工程技术
  • 小类:工程:电子与电气
  • ISSN:2168-6734
  • IF值:2
  • 是否SCI:SCIE
  • 是否OA:No
  • 年文章数:110
  • 审稿速度:
  • 平均录用比例:
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官方网站:http://eds.ieee.org/journal-of-the-electron-devices-society.html

投稿网址:http://mc.manuscriptcentral.com/jeds

PMC链接:http://www.ncbi.nlm.nih.gov/nlmcatalog?term=2168-6734%5BISSN%5D

IEEE Journal of the Electron Devices Society中文简介

《IEEE电子设备学会杂志》(J-EDS)是一本开放的、完全电子化的科学期刊,出版的论文范围从基础研究到应用研究,科学严谨,与电子设备相关。J-EDS发表了有关电子和离子集成电路器件和互连的理论、建模、设计、性能和可靠性的原始和重要贡献,涉及绝缘体、金属、有机材料、微等离子体、半导体、量子效应结构、真空器件和具有应用于生物电子学、生物医学电子学、计算、通信、显示、微电子力学、成像、微驱动器、纳米器件、光电子学、光电学、功率集成电路和微传感器。关于这些主题的教程和评论论文也已出版。此外,偶尔也会出版一些特别的期刊,其中有一些关于更深入和更广泛的特定领域的论文集。J-EDS出版所有被认为是技术上有效和原创的论文。所有的研究论文都得益于快速的同行评审和出版,并存放在IEEExplore中。

IEEE Journal of the Electron Devices Society英文简介

The IEEE Journal of the Electron Devices Society (J-EDS) is an open-access, fully electronic scientific journal publishing papers ranging from fundamental to applied research that are scientifically rigorous and relevant to electron devices. The J-EDS publishes original and significant contributions relating to the theory, modelling, design, performance, and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanodevices, optoelectronics, photovoltaics, power IC's, and micro-sensors. Tutorial and review papers on these subjects are, also, published. And, occasionally special issues with a collection of papers on particular areas in more depth and breadth are, also, published. J-EDS publishes all papers that are judged to be technically valid and original. All research papers benefit from rapid peer review and publication, and are deposited in IEEE Xplore.

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