IEEE Transactions on Components Packaging and Manufacturing Technology

IEEE Transactions on Components Packaging and Manufacturing Technology期刊基本信息

IEEE Transactions on Components Packaging and Manufacturing Technology中文简介

IEEE关于组件、封装和制造的交易涵盖了以下内容领域:建模、设计、构建模块、技术基础设施和支持电子、光子和MEMS封装的分析,以及无源组件、电气触点和连接器、热管理和设备可靠性方面的新发展;以及电子零件和总成的制造,具有广泛的设计、工厂建模、装配方法、质量、产品鲁棒性和环境设计。IEEE技术协会的会员资格提供了访问顶级出版物的机会,如作为会员利益或通过折扣订阅。该杂志的电子版是CPMT协会会员的一部分,但也提供所有媒体类型的购买。

IEEE Transactions on Components Packaging and Manufacturing Technology英文简介

IEEE Transactions on Components, Packaging, and Manufacturing covers the following content areas: modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.Membership in IEEE's technical societies provides access to top quality publications such as this one either as a member benefit or via discounted subscriptions. The electronic version of this journal is part of the CPMT Society membership, but all media types are also offered for purchase.

IEEE Transactions on Components Packaging and Manufacturing Technology中科院分区

大类学科 分区 小类学科 分区 Top期刊 综述期刊
工程技术 3区 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合 ENGINEERING, MANUFACTURING 工程:制造 3区 3区 4区

JCR分区

JCR分区等级 JCR所属学科 分区 影响因子
Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Q3 1.922
ENGINEERING, MANUFACTURING Q4
MATERIALS SCIENCE, MULTIDISCIPLINARY Q4

IEEE Transactions on Components Packaging and Manufacturing Technology影响因子

国际期刊推选 论文翻润预审发表!

选择丰富服务快速通过率高一键快速领取私人专属发表方案!

* 请认真填写需求信息,学术顾问24小时内与您取得联系。